Automotive ASIC Development Made Simple
We support end-to-end automotive ASIC development, from concept to functional safety design, fabrication and advanced packaging.
Applications
ASIC
SoC
Chiplet
Highlights
Digital Twin Simulation
Foundry & OSAT Network
Customers
Automotive OEM
Tier 1 Supplier
Robotics Developer
From Concept to Production in Just 4 Steps
Exploration
Phase 1
We work with your engineering team to define application requirements, performance targets, system architecture, and project objectives including HARA, safety goals, ASIL allocation, FSC, FSR, TSC, TSR, safety mechanisms and preliminary FMEDA/DFA. Architecture exploration and safety analysis is accelerated through shift-left development powered by SiliconPilot™.
Design
Phase 2
We lead the complete automotive silicon design process, ensuring designs are optimized for automotive reliability, including ISO 26262 functional safety, ISO/SAE 21434 cybersecurity, and AEC-Q100 readiness.
Defined product requirements, performance targets, interfaces, and safety objectives to establish the design foundation.
Developed a system architecture optimized for performance, safety, power efficiency, and cost.
Implemented the hardware architecture in synthesizable RTL, translating the design into functional logic.
Verified functional correctness through simulation and coverage analysis before physical implementation.
Converted the verified RTL into a gate-level netlist optimized for timing, power, and silicon area.
Integrated manufacturing test structures to improve fault coverage and production quality.
Organized the physical layout of major functional blocks to optimize performance and manufacturability.
Positioned standard cells to meet timing, power, and area objectives while preparing the design for routing.
Built a balanced clock network to ensure reliable timing across the entire chip.
Connected all components with optimized signal paths while meeting timing and manufacturing constraints.
Completed final verification for timing, power, signal integrity, and manufacturability before tape-out.
Generated the final manufacturing database for semiconductor fabrication.
Fabrication
Phase 3
Once the design is complete, we coordinate closely with qualified semiconductor foundries throughout automotive-grade wafer fabrication and Known Good Die (KGD) validation. We oversee manufacturing readiness and production quality to ensure every design is successfully prepared for the next stage of development.
Packaging
Phase 4
We work with trusted OSAT partners to manage advanced packaging, testing, reliability validation, and production readiness. By supporting your team from package selection through final qualification, we help ensure each device meets quality, performance, and automotive reliability requirements before deployment.
Reach Out for Samples, Specs, or Project Support
Get in Touch